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Flotherm Thermal Analysis
Flotherm Thermal Analysis
Simcenter Flotherm is the leading electronics cooling simulation software for accurate thermal analysis, supporting the development of a thermal digital twin. With over 34 years of development, it enables thermal analysis from initial pre-CAD exploration to final verification across IC packages, PCBs, enclosures, and datacenters.
Flotherm combines SmartPart technology for intelligent gridding, robust Cartesian meshing for complex multi-scale geometries, transient analysis for sub-microsecond events, and BCI-ROM technology that solves up to 40,000 times faster than full 3D CFD, with seamless ECAD/EDA integration.
Key Flotherm Solutions:
- SmartPart intelligent object-associated gridding
- Robust structured-Cartesian meshing
- Transient thermal analysis capability
- BCI-ROM: up to 40,000x faster than full CFD
- IC package and PCB thermal modeling
- Enclosure and datacenter analysis
- ECAD and ODB++ data integration
- MATLAB, VHDL-AMS, and FMU export
SmartPart Technology and Robust Meshing
SmartPart technology provides intelligent object-associated gridding that automatically updates when geometry changes, eliminating re-gridding. The structured-Cartesian solver handles electronics models with thousands of components across length scales from sub-micron to meters.
- Intelligent object-associated gridding
- Automatic grid update on geometry changes
- Handles thousands of components
- Length scales from sub-micron to meters
BCI-ROM Fast Thermal Simulation
Boundary Condition Independent Reduced Order Models (BCI-ROM) solve up to 40,000 times faster than full 3D CFD, enabling rapid design space exploration. Models export to MATLAB Simulink, VHDL-AMS, and FMU formats for system-level simulation integration.
- Up to 40,000x faster than full 3D CFD
- Rapid design space exploration
- Export to MATLAB Simulink and VHDL-AMS
- FMU format for system-level integration
Transient Analysis and ECAD Integration
Flotherm models sub-microsecond timescale transient events, supports time-dependent power dissipation and thermostatic control modeling, and integrates seamlessly with ECAD data including ODB++ file formats through the EDA Bridge for efficient design data processing.
- Sub-microsecond transient event modeling
- Time-dependent power dissipation support
- Thermostatic control modeling
- ODB++ and ECAD data integration via EDA Bridge
