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2.5D PACKAGING
2.5D Packaging
2.5D packaging integrates multiple dies — logic, memory, and accelerators — side-by-side on interposers or embedded bridges, enabling ultra-wide bandwidth, efficient power delivery, and reliable performance. It has become the dominant choice for high-power AI, HPC, and networking systems.
We deliver end-to-end 2.5D packaging solutions through a trusted ecosystem of packaging and assembly partners, providing interposer and bridge design, advanced bumping and assembly, comprehensive test and validation, and local technical coordination and project management.
Key 2.5D Packaging Services:
- Interposer and bridge design (TSVs, RDL, EMIB)
- Advanced bumping and assembly
- Comprehensive test and validation
- Local technical coordination and project management
- Reduced integration risk with known-good-die assembly
- Accelerated development cycles
- Scalable solutions for AI, HPC, and networking
- Reliable production backed by global expertise
Interposer and Bridge Design
Advinno’s packaging ecosystem delivers interposer and bridge design solutions including Through-Silicon Vias (TSVs), Redistribution Layers (RDL), and Embedded Multi-die Interconnect Bridge (EMIB) technology, enabling ultra-high bandwidth die-to-die connectivity for AI, HPC, and custom ASIC applications.
- Through-Silicon Via (TSV) interposer design
- Redistribution Layer (RDL) solutions
- Embedded Multi-die Interconnect Bridge (EMIB)
- Ultra-high bandwidth die-to-die connectivity
Advanced Bumping and Assembly
Advanced bumping and assembly services support the precision required for heterogeneous integration, with known-good-die assembly and validated processes that reduce integration risk and ensure yield in high-value multi-die packages for AI GPUs, HPC ASICs, and networking systems.
- Advanced micro-bump and assembly processes
- Known-good-die assembly for yield assurance
- Validated heterogeneous integration processes
- AI GPU, HPC ASIC, and networking system support
Test, Validation, and Project Management
Comprehensive test and validation services ensure package integrity and electrical performance from prototype through high-volume production. Local technical coordination and project management by Advinno Technologies bridges global packaging expertise with hands-on engineering support.
- Comprehensive package test and validation
- Electrical performance verification
- Prototype through volume production support
- Local technical coordination and project management
