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Ansys HFSS-IC
Ansys HFSS-IC is the industry-leading 3D full-wave electromagnetic simulation platform for integrated circuits and packages. It breaks down design silos by unifying the three best-in-class EM solvers — HFSS, RaptorX, and Q3D Extractor — into one environment, enabling high-fidelity IC-to-system co-design and co-simulation.
Through Advinno Technologies, engineers gain access to HFSS-IC for signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) analysis across RFICs, 3D-ICs, and advanced packaging. The platform delivers early in-design insights that accelerate time to market and ensure first-time-right electronic designs.
Key Ansys HFSS-IC Solutions:
- Signal integrity (SI) analysis for IC packages
- Power integrity (PI) with broadband 3D simulation
- EMI and electromagnetic compliance analysis
- RFIC and millimeter-wave IC design
- 3D-IC and advanced packaging co-simulation
- On-chip silicon EM analysis with RaptorX
- R/L/C/G matrix extraction with Q3D Extractor
- System-aware IC and IC-aware system design
Unified Multi-Solver EM Platform
HFSS-IC integrates three industry-leading solvers in a single design environment: HFSS for high-fidelity full-wave S-parameter and field data, RaptorX for fast on-chip silicon EM analysis using partial element equivalent circuit methods, and Q3D Extractor for accurate resistance, inductance, capacitance, and conductance matrix extraction.
- HFSS full-wave finite element method (FEM) solver
- RaptorX on-chip silicon PEEC solver
- Q3D Extractor for R/L/C/G matrix extraction
- Single unified design environment for all solvers
Signal and Power Integrity Analysis
HFSS-IC delivers comprehensive signal integrity and power integrity analysis for IC, package, and board designs. HFSS PI is the industry’s first high-fidelity broadband 3D power delivery simulation, offering the speed, capacity, and accuracy required to meet modern power delivery challenges across complex multi-die systems.
- High-fidelity broadband 3D power integrity (PI)
- Signal integrity (SI) for high-speed interconnects
- Cross-talk, insertion loss, and return loss analysis
- IC, package, and board co-simulation
Advanced Packaging and 3D-IC Design
HFSS-IC addresses the increasing complexity of advanced packaging technologies including 3D-ICs, chiplets, and heterogeneous integration. The platform enables multiphysics and multiscale simulation for IC-to-system designs, supporting RFICs, advanced packaging, and next-generation semiconductor integration with cross-team collaboration workflows.
- 3D-IC and chiplet co-design support
- Heterogeneous integration simulation
- RFIC and millimeter-wave package analysis
- Multiphysics multiscale IC-to-system workflows
