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HFSS
- Overview
- Capabilities
3D EM SIMULATION SOFTWARE
3D Electromagnetic Field Simulator for RF and Wireless Design
Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.
Component-to-System EM Workflow - Coupled EM System Solver
Encrypted 3D Design Share Automatic Adaptive Meshing
Product Specs
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB and EMI problems for most complex systems.
*only available with Electronics Enterprise
Antenna Design Toolkit Radar Pre/Post Processing Frequency and Time Domain FEM Hybrid FEM/IE/SBR+ Solver 3D Layout ECAD Flow *SBR+ Accelerated Doppler Processing
- Integral Equation (MoM)
Memory Matrix Solvers 5G Post-Processing Concurrent Initial 3D Meshing SBR+ for Large Scale EMs Multipaction Solver
Physics Defines the Mesh; Mesh Does Not Define the Physics
The Ansys HFSS simulation suite consists of a comprehensive set of solvers to address diverse electromagnetic problems ranging in detail and scale from passive IC components to extremely large-scale EM analyses such as automotive radar scenes for ADAS systems. Its reliable automatic adaptive mesh refinement lets you focus on the design instead of spending time determining and creating the best mesh.
This automation and guaranteed accuracy differentiates HFSS from all other EM simulators, which require manual user control and multiple solutions to ensure that the generated mesh is suitable and accurate.
Key Features
HFSS is the premier EM tool for R&D and virtual design prototyping. It reduces design cycle time and boosts your product’s reliability and performance.
- EMI/EMC analysis
- Radio Frequency Interference (RFI) in complex environments
- Installed antenna and RF cosite analysis
- RF systems and circuits analysis
- Signal and Power Integrity analysis
EMI/EMC Analysis
Ansys Electronics Desktop enables engineers to easily combine the unmatched accuracy of Ansys electromagnetic 3D and 2.5D field solvers and the powerful circuit- and system-level solutions in Ansys RF Option to diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
Radio Frequency Interference (RFI) in Complex Environments
EMIT works hand-in-hand with Ansys HFSS to combine RF system interference analysis with best-in-class electromagnetic simulation for modeling installed antenna-to-antenna coupling. The result is a complete solution to reliably predict the effects of RFI in multi-antenna environments with multiple transmitters and receivers.
Installed Antenna and RF Cosite Analysis
In Ansys HFSS, engineers can simulate infinite and finite phased-array antennas with all electromagnetic effects, including mutual coupling, array lattice definition, finite array edge effects, dummy elements and element blanking, through advanced unit cell simulation.
RF Systems and Circuits Analysis+
When combined with HFSS, circuits and RF systems simulation technologies create an end-to-end high-performance workflow for RF, EMI/EMC and other applications.
Signal and Power Integrity Analysis+
When combined with HFSS, SI Circuits can be used for analyzing signal integrity, power integrity and EMI issues caused by shrinking timing and noise margins in PCBs, electronic packages, connectors and other complex electronic interconnects.
Encrypted 3D Components
Encrypted 3D Component support in HFSS 3D Layout allows companies to share their detailed component designs (connector, antenna, SMD chip capacitor) without divulging IP such as geometry and material properties.
Multipaction
Ansys HFSS has been enhanced with multipaction analysis, which solves for an electronic phenomenon that can cause breakdown due to high electric fields in a vacuum, enhancing solutions for aerospace applications as well as 5G satellites.
