{"id":7257,"date":"2026-04-30T10:38:31","date_gmt":"2026-04-30T03:38:31","guid":{"rendered":"https:\/\/www.advinno.com\/?p=7257"},"modified":"2026-04-30T10:39:36","modified_gmt":"2026-04-30T03:39:36","slug":"hfss-2","status":"publish","type":"post","link":"https:\/\/www.advinno.com\/sg\/hfss-2\/","title":{"rendered":"\u9ad8\u9891SS"},"content":{"rendered":"
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Ansys HFSS-IC<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Ansys HFSS-IC is the industry-leading 3D full-wave electromagnetic simulation platform for integrated circuits and packages. It breaks down design silos by unifying the three best-in-class EM solvers — HFSS, RaptorX, and Q3D Extractor — into one environment, enabling high-fidelity IC-to-system co-design and co-simulation.<\/p>

Through Advinno Technologies, engineers gain access to HFSS-IC for signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) analysis across RFICs, 3D-ICs, and advanced packaging. The platform delivers early in-design insights that accelerate time to market and ensure first-time-right electronic designs.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Key Ansys HFSS-IC Solutions:<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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  • Signal integrity (SI) analysis for IC packages<\/li>
  • Power integrity (PI) with broadband 3D simulation<\/li>
  • EMI and electromagnetic compliance analysis<\/li>
  • RFIC and millimeter-wave IC design<\/li><\/ul><\/div><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
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    • 3D-IC and advanced packaging co-simulation<\/li>
    • On-chip silicon EM analysis with RaptorX<\/li>
    • R\/L\/C\/G matrix extraction with Q3D Extractor<\/li>
    • System-aware IC and IC-aware system design<\/li><\/ul><\/div><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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      Unified Multi-Solver EM Platform<\/span><\/h5><\/div><\/div>

      HFSS-IC integrates three industry-leading solvers in a single design environment: HFSS for high-fidelity full-wave S-parameter and field data, RaptorX for fast on-chip silicon EM analysis using partial element equivalent circuit methods, and Q3D Extractor for accurate resistance, inductance, capacitance, and conductance matrix extraction.<\/p><\/div><\/div><\/div>

      • HFSS full-wave finite element method (FEM) solver<\/li>
      • RaptorX on-chip silicon PEEC solver<\/li>
      • Q3D Extractor for R\/L\/C\/G matrix extraction<\/li>
      • Single unified design environment for all solvers<\/li><\/ul><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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        Signal and Power Integrity Analysis<\/span><\/h5><\/div><\/div>

        HFSS-IC delivers comprehensive signal integrity and power integrity analysis for IC, package, and board designs. HFSS PI is the industry’s first high-fidelity broadband 3D power delivery simulation, offering the speed, capacity, and accuracy required to meet modern power delivery challenges across complex multi-die systems.<\/p><\/div><\/div><\/div>

        • High-fidelity broadband 3D power integrity (PI)<\/li>
        • Signal integrity (SI) for high-speed interconnects<\/li>
        • Cross-talk, insertion loss, and return loss analysis<\/li>
        • IC, package, and board co-simulation<\/li><\/ul><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
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          Advanced Packaging and 3D-IC Design<\/span><\/h5><\/div><\/div>

          HFSS-IC addresses the increasing complexity of advanced packaging technologies including 3D-ICs, chiplets, and heterogeneous integration. The platform enables multiphysics and multiscale simulation for IC-to-system designs, supporting RFICs, advanced packaging, and next-generation semiconductor integration with cross-team collaboration workflows.<\/p><\/div><\/div><\/div>

          • 3D-IC and chiplet co-design support<\/li>
          • Heterogeneous integration simulation<\/li>
          • RFIC and millimeter-wave package analysis<\/li>
          • Multiphysics multiscale IC-to-system workflows<\/li><\/ul><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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            Ansys HFSS-IC Ansys HFSS-IC is the industry-leading 3D full-wave electromagnetic simulation platform for integrated circuits and packages. It breaks down design silos by unifying the three best-in-class EM solvers — HFSS, RaptorX, and Q3D Extractor — into one environment, enabling high-fidelity IC-to-system co-design and co-simulation. Through Advinno Technologies, engineers gain access to HFSS-IC for signal […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-7257","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"_links":{"self":[{"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/posts\/7257","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/comments?post=7257"}],"version-history":[{"count":3,"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/posts\/7257\/revisions"}],"predecessor-version":[{"id":7267,"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/posts\/7257\/revisions\/7267"}],"wp:attachment":[{"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/media?parent=7257"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/categories?post=7257"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.advinno.com\/sg\/wp-json\/wp\/v2\/tags?post=7257"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}